US 11,808,803 B2
Standalone thermal chamber for a temperature control component
Daniel G. Scobee, Ione, CA (US); Aleksandr Semenuk, Orangevale, CA (US); and Aswin Thiruvengadam, Folsom, CA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Oct. 28, 2022, as Appl. No. 17/976,607.
Application 17/976,607 is a continuation of application No. 16/711,106, filed on Dec. 11, 2019, granted, now 11,493,550.
Prior Publication US 2023/0046331 A1, Feb. 16, 2023
Int. Cl. G01R 31/28 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01)
CPC G01R 31/2817 (2013.01) [H05K 1/181 (2013.01); H05K 7/20 (2013.01); H05K 2201/10219 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal chamber comprising:
a plurality of sides that form an enclosed chamber;
a first side of the plurality of sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber; and
a second side of the plurality of sides, the second side located opposite the first side and comprising one or more ports that expose the enclosed chamber, wherein each of the one or more ports comprise an opening configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board, and wherein the opening is further configured to position the temperature control component such that a bottom part of the temperature control component couples to the electronic devices within the enclosed chamber and a top part of the temperature control component extends outside the thermal chamber.