US 11,808,643 B2
Thermal conductivity pressure gauge with heated chamber wall
Gerardo A. Brucker, Longmont, CO (US); and Timothy C. Swinney, Fort Collins, CO (US)
Assigned to MKS INSTRUMENTS, INC., Andover, MA (US)
Filed by MKS Instruments, Inc., Andover, MA (US)
Filed on Nov. 3, 2021, as Appl. No. 17/453,450.
Claims priority of provisional application 63/114,287, filed on Nov. 16, 2020.
Prior Publication US 2022/0155172 A1, May 19, 2022
Int. Cl. G01L 21/12 (2006.01); G01L 21/14 (2006.01); G01L 11/00 (2006.01)
CPC G01L 21/12 (2013.01) [G01L 11/002 (2013.01); G01L 21/14 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A thermal conductivity pressure gauge comprising:
a sensor resistor;
a sensor chamber having a chamber wall spaced from the sensor resistor;
a heater configured to heat the chamber wall; and
electronics configured to, during a process, apply power to the sensor resistor and determine pressure of gas in the sensor chamber based on a relationship between resistance of the sensor resistor and applied power and apply power to the heater to heat the chamber wall to control temperature difference between the sensor resistor and the chamber wall, the electronics being further configured to, between process runs, elevate temperature of the chamber wall to dry the chamber wall.