US 11,808,420 B2
LED vehicle lamp with frustum base plate
Zongtao Li, Guangzhou (CN); Binhai Yu, Guangzhou (CN); Yong Tang, Guangzhou (CN); Caiman Yan, Guangzhou (CN); Cunjiang Song, Guangzhou (CN); Qiliang Zhao, Guangzhou (CN); and Longshi Rao, Guangzhou (CN)
Assigned to SOUTH CHINA UNIVERSITY OF TECHNOLOGY, Guangdong (CN)
Appl. No. 17/613,855
Filed by SOUTH CHINA UNIVERSITY OF TECHNOLOGY, Guangzhou (CN)
PCT Filed Jul. 2, 2020, PCT No. PCT/CN2020/099927
§ 371(c)(1), (2) Date Nov. 23, 2021,
PCT Pub. No. WO2021/000916, PCT Pub. Date Jan. 7, 2021.
Claims priority of application No. 201910592162.1 (CN), filed on Jul. 3, 2019.
Prior Publication US 2022/0316674 A1, Oct. 6, 2022
Int. Cl. F21S 41/151 (2018.01); F21S 45/40 (2018.01); F21S 41/148 (2018.01); F21S 41/176 (2018.01); F21S 45/47 (2018.01); F21Y 107/90 (2016.01)
CPC F21S 41/151 (2018.01) [F21S 41/148 (2018.01); F21S 41/176 (2018.01); F21S 45/40 (2018.01); F21S 45/47 (2018.01); F21Y 2107/90 (2016.08)] 8 Claims
OG exemplary drawing
 
1. An LED vehicle lamp with a frustum base plate, comprising a base plate, a circuit board and a plurality of LED chips, wherein the base plate is a frustum base plate, which is arranged on an axis of the LED vehicle lamp, a width of an upper bottom surface of the frustum base plate is smaller than that of a lower bottom surface of the frustum base plate, the lower bottom surface is opposite to the upper bottom surface, an axis of the circuit board is parallel to an axis of the frustum base plate, a width of the circuit board is smaller than that of the upper bottom surface of the frustum base plate, the circuit board is installed on the upper bottom surface of the frustum base plate, and the plurality of LED chips are installed on the circuit board;
wherein the circuit board comprises a first circuit board and a second circuit board, the first circuit board is installed on the upper bottom surface of the frustum base plate, the second circuit board is installed on the lower bottom surface of the frustum base plate, the plurality of LED chips comprise a plurality of first LED chips and a plurality of second LED chips, the plurality of first LED chips are installed on the first circuit board in an inverted mode, a first transparent substrate is arranged on a back of each the first LED chip, a first phosphor is arranged on the first transparent substrate, and the first LED chip and the first transparent substrate are coated with the first phosphor; the plurality of second LED chips are installed on the second circuit board in an inverted mode, a second transparent substrate is arranged on a back of each the second LED chip, a second phosphor is arranged on the second transparent substrate, and the second LED chip and the second transparent substrate are coated with the second phosphor;
wherein the first phosphor comprises a first fluorescent glue lens, and lateral parts of the first LED chip and the first transparent substrate are coated with the first fluorescent glue lens; the second phosphor comprises a second fluorescent glue lens, lateral parts of the second LED chip and the second transparent substrate are coated with the second fluorescent glue lens, both the first fluorescent glue lens and the second fluorescent glue lens are of spherical structures; and
wherein a clamping position is arranged on an upper part of the frustum base plate, the first fluorescent glue lens is provided with a clamp, and the clamping position is matched with the clamp to connect the first fluorescent glue lens and the frustum base plate.