US 11,807,947 B2
Methods for producing an etch resist pattern on a metallic surface
Nava Shpaisman, Kedumim (IL); and Moshe Frenkel, Jerusalem (IL)
Assigned to Kateeva, Inc., Newark, CA (US)
Filed by Kateeva, Inc., Newark, CA (US)
Filed on Jan. 12, 2022, as Appl. No. 17/647,756.
Application 17/647,756 is a continuation of application No. 16/948,597, filed on Sep. 24, 2020, granted, now 11,255,018.
Application 16/948,597 is a continuation of application No. 15/751,866, granted, now 10,806,035, issued on Sep. 23, 2020, previously published as PCT/IL2016/050820, filed on Jul. 27, 2016.
Claims priority of provisional application 62/204,508, filed on Aug. 13, 2015.
Prior Publication US 2022/0136113 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C23F 1/02 (2006.01); C09D 11/101 (2014.01); B41M 5/00 (2006.01); G03F 7/20 (2006.01); H05K 3/00 (2006.01); G03F 1/50 (2012.01); H10K 71/13 (2023.01); H05K 3/06 (2006.01); C09D 11/30 (2014.01); C23F 1/00 (2006.01)
CPC C23F 1/02 (2013.01) [B41M 5/0058 (2013.01); C09D 11/101 (2013.01); C09D 11/30 (2013.01); C23F 1/00 (2013.01); G03F 1/50 (2013.01); G03F 7/2018 (2013.01); H05K 3/0002 (2013.01); H05K 3/0017 (2013.01); H05K 3/0079 (2013.01); H05K 3/061 (2013.01); H10K 71/13 (2023.02); H10K 71/135 (2023.02); H05K 2203/013 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/1173 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a metallic pattern on a substrate, the method comprising:
chemically activating a metallic surface of a substrate to form metal ions;
after chemically activating the metallic surface, selectively printing an etch-resist ink onto the metallic surface;
reacting a component of the etch-resist ink with the ions to immobilize the etch-resist ink into an etch-resist mask on the metallic surface; and
performing an etching process to remove portions of the metallic layer that are not covered by the etch-resist mask to form the metallic pattern.