CPC C23F 1/02 (2013.01) [B41M 5/0058 (2013.01); C09D 11/101 (2013.01); C09D 11/30 (2013.01); C23F 1/00 (2013.01); G03F 1/50 (2013.01); G03F 7/2018 (2013.01); H05K 3/0002 (2013.01); H05K 3/0017 (2013.01); H05K 3/0079 (2013.01); H05K 3/061 (2013.01); H10K 71/13 (2023.02); H10K 71/135 (2023.02); H05K 2203/013 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/1173 (2013.01)] | 20 Claims |
1. A method of forming a metallic pattern on a substrate, the method comprising:
chemically activating a metallic surface of a substrate to form metal ions;
after chemically activating the metallic surface, selectively printing an etch-resist ink onto the metallic surface;
reacting a component of the etch-resist ink with the ions to immobilize the etch-resist ink into an etch-resist mask on the metallic surface; and
performing an etching process to remove portions of the metallic layer that are not covered by the etch-resist mask to form the metallic pattern.
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