US 11,807,754 B2
Heat-curable urethane resin composition, film, and article
Daichi Higuchi, Takaishi (JP); and Yuichiro Shiba, Takaishi (JP)
Assigned to DIC Corporation, Tokyo (JP)
Appl. No. 16/772,957
Filed by DIC Corporation, Tokyo (JP)
PCT Filed Nov. 1, 2018, PCT No. PCT/JP2018/040670
§ 371(c)(1), (2) Date Oct. 22, 2020,
PCT Pub. No. WO2019/093219, PCT Pub. Date May 16, 2019.
Claims priority of application No. 2017-214640 (JP), filed on Nov. 7, 2017.
Prior Publication US 2021/0163738 A1, Jun. 3, 2021
Int. Cl. C08G 18/44 (2006.01); C08L 75/04 (2006.01); C08G 18/10 (2006.01); C08G 18/32 (2006.01); C08G 18/73 (2006.01); C08G 18/79 (2006.01); C08G 18/83 (2006.01)
CPC C08L 75/04 (2013.01) [C08G 18/10 (2013.01); C08G 18/3203 (2013.01); C08G 18/3206 (2013.01); C08G 18/44 (2013.01); C08G 18/73 (2013.01); C08G 18/791 (2013.01); C08G 18/83 (2013.01); C08G 2150/00 (2013.01); C08L 2203/16 (2013.01)] 12 Claims
 
1. A thermosetting urethane resin composition comprising a main agent (i) containing a urethane prepolymer (A) and an organic solvent (B) and a curing agent (ii), the urethane prepolymer (A) having a hydroxy group at an end and containing a composition that contains a polyol (a1), a polyisocyanate (a2), and a chain extender (a3),
wherein:
the polyol (a1) contains a polyol having no aromatic ring (a1-1),
the polyol having no aromatic ring (a1-1) contains a polycarbonate polyol that is in a liquid state at 25° C. and a polycarbonate polyol that is in a solid state at 25° C.,
the polyisocyanate (a2) contains a polyisocyanate having no aromatic ring (a2-1),
the chain extender (a3) contains a triol having a molecular weight of 500 or less,
the curing agent (ii) contains a triisocyanate,
in the thermosetting urethane resin composition, a percentage of a total amount of the triol having a molecular weight of 500 or less and the triisocyanate is 10 mass % or higher and 35 mass % or lower, and
in the thermosetting urethane resin composition, a percentage of the polycarbonate polyol in a liquid state at 25° C. is 25 mass % or higher and 50 mass % or lower.