US 11,807,751 B2
Resin composition and molding method thereof
Seiji Morita, Tokyo (JP); Jin Nasukawa, Tokyo (JP); Kenichi Sato, Tokyo (JP); and Laksmi Kusumawardhani, Tokyo (JP)
Assigned to Hemicellulose Ltd., Kanagawa (JP)
Filed by Hemicellulose Ltd., Kanagawa (JP)
Filed on Dec. 5, 2019, as Appl. No. 16/704,226.
Claims priority of application No. 2019-030378 (JP), filed on Feb. 22, 2019.
Prior Publication US 2020/0270430 A1, Aug. 27, 2020
Int. Cl. C08L 5/14 (2006.01); B29C 45/18 (2006.01); B29C 45/56 (2006.01); B29C 45/73 (2006.01); B29C 45/74 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 33/12 (2006.01); C08L 67/02 (2006.01); C08L 67/04 (2006.01); C08L 69/00 (2006.01)
CPC C08L 5/14 (2013.01) [B29C 45/1816 (2013.01); B29C 45/561 (2013.01); B29C 45/7337 (2013.01); B29C 45/74 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 33/12 (2013.01); C08L 67/02 (2013.01); C08L 67/04 (2013.01); C08L 69/00 (2013.01); B29C 2945/76361 (2013.01); B29K 2005/00 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A resin composition for molding, comprising a first resin that is derived from a plant having the structure of Formula 1:

OG Complex Work Unit Chemistry
wherein:
each of R1 and R2 is independently selected from an alkyl group; and
n is an integer equal to or greater than 2.