	US 11,807,750 B2
	Compositions with increased electrical conductivity
John E. Stroh, Sugar Grove, IL (US); and Jody D. Riddle, West Chicago, IL (US)
Assigned to LyondellBasell Advanced Polymers Inc., Houston, TX (US)
Filed by LYONDELLBASELL ADVANCED POLYMERS INC., Houston, TX (US)
Filed on Jul. 6, 2021, as Appl. No. 17/368,278.
Claims priority of provisional application 63/053,425, filed on Jul. 17, 2020.
Prior Publication US 2022/0017737 A1, Jan. 20, 2022
Int. Cl. C08L 29/04 (2006.01); H01M 8/0213 (2016.01); H01M 8/0221 (2016.01); H01M 8/0226 (2016.01)

CPC C08L 29/04 (2013.01) [H01M 8/0213 (2013.01); H01M 8/0221 (2013.01); H01M 8/0226 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C08L 2310/00 (2013.01)]

13 Claims

1. A bulk molding compound (BMC) composition comprising:

a) a vinyl ester resin system;

b) a curing package;

c) an additive package;

d) graphene nanoplatelets present in an amount that is greater than 0 to about 2 wt. %, based on the total weight of the BMC composition; and,

e) one or more conductive fillers, wherein said one or more conductive fillers is a mixture of graphite particles having small particles sizes between 30 and 60 microns and large particle sizes above 120 microns.