US 11,807,442 B2
Pith filled honeycomb insulating panels and packages
Martinus G. M. L. Jansen, Cornelius, NC (US); and Jannica Z. J. Greife, Charlotte, NC (US)
Assigned to Smartech International LP, Charlotte, NC (US)
Filed by Smartech International LP, Charlotte, NC (US)
Filed on Dec. 7, 2020, as Appl. No. 17/113,636.
Prior Publication US 2022/0177215 A1, Jun. 9, 2022
Int. Cl. B65D 81/38 (2006.01); B65D 65/46 (2006.01); B32B 3/12 (2006.01); B32B 29/00 (2006.01)
CPC B65D 81/3823 (2013.01) [B32B 3/12 (2013.01); B32B 29/002 (2013.01); B65D 65/466 (2013.01); B32B 2255/02 (2013.01); B32B 2255/12 (2013.01); B32B 2264/062 (2013.01); B32B 2307/304 (2013.01); B32B 2307/7163 (2013.01); B32B 2307/72 (2013.01); B32B 2307/73 (2013.01); B32B 2553/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A biodegradable insulating panel for a package, comprising:
a first layer of biodegradable material;
a second layer of biodegradable material opposite the first layer;
a moisture repellant layer disposed on exterior surfaces of the first and second layers;
a biodegradable honeycomb core disposed between the first and second layers; and
granulated corn pith disposed within cells of the honeycomb core to increase the resistance to heat flow of the panel,
wherein the granulated corn pith has an average particle size no greater than about 2 mm.