US 11,807,010 B2
Liquid ejecting apparatus and maintenance method of liquid ejecting apparatus
Tomoki Shinoda, Shiojiri (JP); Takeshi Iwamuro, Matsumoto (JP); and Hitotoshi Kimura, Matsumoto (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 1, 2023, as Appl. No. 18/176,963.
Application 18/176,963 is a continuation of application No. 17/374,184, filed on Jul. 13, 2021, granted, now 11,618,260.
Claims priority of application No. 2020-121952 (JP), filed on Jul. 16, 2020.
Prior Publication US 2023/0202179 A1, Jun. 29, 2023
Int. Cl. B41J 2/165 (2006.01); B41J 2/175 (2006.01)
CPC B41J 2/16544 (2013.01) [B41J 2/17596 (2013.01); B41J 2002/16594 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A liquid ejecting apparatus comprising:
a liquid ejecting portion configured to eject liquid;
a pressurizing mechanism configured to pressurize an inside of the liquid ejecting portion, wherein
the pressurizing mechanism includes a liquid outflow portion having a flexible portion formed by a flexible member,
the liquid ejecting portion includes a first liquid ejecting portion and a second liquid ejecting portion,
the liquid outflow portion includes a first liquid outflow portion communicating with the first liquid ejecting portion and a second liquid outflow portion communicating with the second liquid ejecting portion,
the first liquid outflow portion includes a first flexible portion,
the second liquid outflow portion includes a second flexible portion, and
the pressurizing mechanism changes a volume of the first liquid outflow portion and a volume of the second liquid outflow portion via one closed space.