US 11,806,805 B2
Workpiece cutting method
Mikiharu Kuchiki, Tokyo (JP); Hidefumi Kinda, Tokyo (JP); Daisuke Kurita, Tokyo (JP); Takeshi Sakamoto, Hamamatsu (JP); Takafumi Ogiwara, Hamamatsu (JP); Yuta Kondoh, Hamamatsu (JP); and Naoki Uchiyama, Hamamatsu (JP)
Assigned to Kyoritsu Chemical & Co., Ltd., Tokyo (JP); and HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 16/614,882
Filed by Kyoritsu Chemical & Co., Ltd., Tokyo (JP); and HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed May 17, 2018, PCT No. PCT/JP2018/019171
§ 371(c)(1), (2) Date Nov. 19, 2019,
PCT Pub. No. WO2018/216600, PCT Pub. Date Nov. 29, 2018.
Claims priority of application No. 2017-102743 (JP), filed on May 24, 2017.
Prior Publication US 2020/0180075 A1, Jun. 11, 2020
Int. Cl. B23K 26/16 (2006.01); B23K 26/40 (2014.01); H01L 21/50 (2006.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); B23K 101/40 (2006.01); B23K 26/53 (2014.01)
CPC B23K 26/16 (2013.01) [B23K 26/40 (2013.01); B23K 26/53 (2015.10); H01L 21/50 (2013.01); H01L 21/67092 (2013.01); H01L 21/78 (2013.01); B23K 2101/40 (2018.08)] 11 Claims
OG exemplary drawing
 
1. An object cutting method comprising:
a first step of attaching an expandable sheet to a first surface of an object to be processed, wherein the first surface is either one of a front surface or a back surface of the object;
a second step of, after the first step, irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object;
a third step of, after the second step, filling the gap with a resin by dripping the resin along an outer edge portion including the side surface of the object, so that the resin flows through the gap and does not protrude from a second surface of the object, wherein the second surface is either one of the front surface or the back surface to which the expandable sheet is not attached in the first step;
a fourth step of, after the third step, curing and shrinking the resin such that the resin is configured to peel from the chips; and
a fifth step of, after the fourth step, taking out the chips from the expandable sheet.