CPC B22F 9/20 (2013.01) [C22B 3/08 (2013.01); C22B 5/00 (2013.01); C22B 15/0071 (2013.01); C22B 15/0089 (2013.01); B22F 2301/10 (2013.01)] | 18 Claims |
1. A process, comprising:
preparing an aqueous solution comprising a copper(II) salt and a halide;
contacting a reducing metal with the aqueous solution;
stirring and/or circulating the aqueous solution;
producing granular copper on a surface of the reducing metal and is weakly adhered thereto; and
removing the granular copper from the surface of the reducing metal by force of gravity without scraping,
wherein the reducing metal is iron,
wherein the molar ratio of the halide to the copper(II) in the aqueous solution is from about 3:1 to about 5:1, and
wherein the aqueous solution has a pH between about 2 and about 3.
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