US 11,806,767 B2
Substrate processing apparatus and substrate processing method
Ho Jong Hwang, Hwaseong-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on May 26, 2022, as Appl. No. 17/825,049.
Claims priority of application No. 10-2021-0168349 (KR), filed on Nov. 30, 2021.
Prior Publication US 2023/0166307 A1, Jun. 1, 2023
Int. Cl. B08B 9/093 (2006.01)
CPC B08B 9/093 (2013.01) 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a spraying unit installed in an inner space of a chamber member in which a substrate is processed, configured to spray a cleaning liquid into the inner space of the chamber member so as to clean devices for discharging a chemical liquid to the substrate and then collecting the chemical liquid, and configured to spray a drying gas for drying the remaining cleaning liquid into the inner space of the chamber member;
a management unit configured to remove a residue remaining on the spraying unit; and
a controller configured to control the spraying unit and the management unit.