US 11,806,752 B2
Ultrasound transducer and method for wafer level front face attachment
Flavien Daloz, Antibes (FR); Philippe Menage, Vence (FR); Edouard Da Cruz, Nice (FR); Jean Pierre Malacrida, Saint Laurent (FR); Giandonato Stallone, Nice (FR); and Coraly Cuminatto, Le Cannet (FR)
Assigned to GENERAL ELECTRIC COMPANY, Schenectady, NY (US)
Filed by General Electric Company, Schenectady, NY (US)
Filed on Feb. 6, 2020, as Appl. No. 16/783,900.
Application 16/783,900 is a division of application No. 15/385,620, filed on Dec. 20, 2016, granted, now 10,596,598.
Prior Publication US 2020/0171543 A1, Jun. 4, 2020
Int. Cl. H10N 30/50 (2023.01); H10N 30/088 (2023.01); B06B 1/06 (2006.01); A61B 8/12 (2006.01); A61B 8/00 (2006.01)
CPC B06B 1/0644 (2013.01) [B06B 1/0622 (2013.01); H10N 30/088 (2023.02); H10N 30/50 (2023.02); A61B 8/12 (2013.01); A61B 8/4483 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method, comprising:
laminating a comb structure and a conductive base package into an acoustic stack with a non-conductive glue, the comb structure comprising a first fin including a piezoelectric layer intermediate a matching layer and a backing layer, the conductive base package comprising a second fin that extends laterally from the conductive base package, the conductive base package forming a bottom surface of the acoustic stack;
grinding the acoustic stack, a top surface of the ground acoustic stack including a top surface of the second fin of the conductive base package; and
dicing the ground acoustic stack along a plane extending from the top surface of the second fin of the conductive base package to the bottom surface of the acoustic stack and intersecting the second fin, thereby producing an ultrasound transducer having a flat front face comprising:
a ground pad formed by the conductive base package;
a signal pad formed by the matching layer; and
a non-conductive groove separating the ground pad and the signal pad.