CPC B06B 1/0644 (2013.01) [B06B 1/0622 (2013.01); H10N 30/088 (2023.02); H10N 30/50 (2023.02); A61B 8/12 (2013.01); A61B 8/4483 (2013.01)] | 13 Claims |
1. A method, comprising:
laminating a comb structure and a conductive base package into an acoustic stack with a non-conductive glue, the comb structure comprising a first fin including a piezoelectric layer intermediate a matching layer and a backing layer, the conductive base package comprising a second fin that extends laterally from the conductive base package, the conductive base package forming a bottom surface of the acoustic stack;
grinding the acoustic stack, a top surface of the ground acoustic stack including a top surface of the second fin of the conductive base package; and
dicing the ground acoustic stack along a plane extending from the top surface of the second fin of the conductive base package to the bottom surface of the acoustic stack and intersecting the second fin, thereby producing an ultrasound transducer having a flat front face comprising:
a ground pad formed by the conductive base package;
a signal pad formed by the matching layer; and
a non-conductive groove separating the ground pad and the signal pad.
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