US 11,805,970 B2
Three-dimensional adhesive device having a microelectronic system embedded therein
Susanne Holm Faarbaek, Vaerloese (DK); Karsten Hoppe, Copenhagen (DK); Peter Boman Samuelsen, Rungsted Kyst (DK); and Jens Branebjerg, Hoersholm (DK)
Assigned to Braemar Manufacturing, LLC, Eagan, MN (US)
Filed by BRAEMAR MANUFACTURING, LLC, Eagan, MN (US)
Filed on Mar. 4, 2019, as Appl. No. 16/291,339.
Application 16/291,339 is a continuation of application No. 11/886,032, abandoned, previously published as PCT/DK2006/050006, filed on Mar. 9, 2006.
Claims priority of application No. PA 2005 00354 (DK), filed on Mar. 9, 2005; and application No. PA 2005 01748 (DK), filed on Dec. 9, 2005.
Prior Publication US 2019/0374163 A1, Dec. 12, 2019
Int. Cl. A61B 5/00 (2006.01); A61B 5/259 (2021.01); A61B 5/145 (2006.01); A61B 5/02 (2006.01); A61B 5/024 (2006.01); A61B 5/291 (2021.01); A61B 5/296 (2021.01)
CPC A61B 5/68335 (2017.08) [A61B 5/0002 (2013.01); A61B 5/259 (2021.01); A61B 5/411 (2013.01); A61B 5/6833 (2013.01); A61B 5/02 (2013.01); A61B 5/024 (2013.01); A61B 5/14532 (2013.01); A61B 5/14539 (2013.01); A61B 5/14542 (2013.01); A61B 5/14546 (2013.01); A61B 5/291 (2021.01); A61B 5/296 (2021.01); A61B 2560/0412 (2013.01); A61B 2562/08 (2013.01); Y10T 29/49002 (2015.01); Y10T 428/14 (2015.01)] 19 Claims
OG exemplary drawing
 
1. A sensor assembly adapted to be attached to the body surface of a mammal, comprising:
an encapsulated sensor circuit including a plurality of electrical components arranged on a printed circuit board, wherein the plurality of electrical components includes an antenna and a microprocessor, wherein the encapsulated sensor circuit is encapsulated in one of a polymer film, a polymer foil, a polymer coating, a glass, or a ceramic material, and wherein the encapsulated sensor circuit has a proximal portion and a distal portion, the proximal portion of the encapsulated sensor circuit being configured to couple to the body surface of the mammal;
at least one power source for powering at least the antenna and the microprocessor of the encapsulated sensor circuit;
an adhesive device including at least one adhesive for attaching the sensor assembly to the body surface of the mammal, wherein a portion of the adhesive device extends distal to the distal portion of the encapsulated sensor circuit, the adhesive device being adhesively coupled to, and contacting, the at least one power source in a first contact area and being adhesively coupled to, and contacting, the encapsulated sensor circuit in a second contact area, wherein the adhesive coupling between the adhesive device and the power source resists greater pull force than does the adhesive coupling between the adhesive device and the encapsulated sensor circuit, and wherein the adhesive device does not include electrical contacts; and
a housing at least partially containing the encapsulated sensor circuit, the housing having a recess adapted to receive the at least one power source, wherein the housing is formed of a proximal housing part and a distal housing part;
wherein the first contact area is less than the second contact area.