| US 7,616,447 B2 | ||
| IC card | ||
| Hiroyuki Yamada, Osaka (Japan); Yoshiteru Mori, Osaka (Japan); Kenji Nishimura, Osaka (Japan); and Yutaka Nakamura, Osaka (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Appl. No. 11/629,789 PCT Filed Jun. 17, 2005, PCT No. PCT/JP2005/011149 § 371(c)(1), (2), (4) Date Apr. 09, 2007, PCT Pub. No. WO2005/124670, PCT Pub. Date Dec. 29, 2005. |
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| Claims priority of application No. 2004-181039 (JP), filed on Jun. 18, 2004. | ||
| Prior Publication US 2007/0263365 A1, Nov. 15, 2007 | ||
| Int. Cl. H05K 1/14 (2006.01) | ||
| U.S. Cl. 361—737 [361/748] | 11 Claims |
| 1. An IC card comprising:
a semiconductor component having at least two operation modes;
a substrate on which the semiconductor component is mounted;
a housing accommodating the substrate; and
a physical switch for switching the operation modes of the semiconductor component
wherein the physical switch comprises:
a plurality of electric contacts provided on the substrate; and
a movable molded component comprising a contact terminal for switching electric connection of the electric contacts and a
holding section, wherein the holding section is partially outside of the housing to permit manipulation thereof,
wherein a part of an inner surface of the housing directly contacts the molded component so as to press the molded component
against a surface of the substrate where the electric contact is provided, thereby maintaining contact pressure of the contact
terminal against the electric contact.
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