US 7,616,024 B2
Resilient integrated circuit architecture
Steven Hennick Kelem, Los Altos Hills, Calif. (US); Jaime C. Cummins, Saratoga, Calif. (US); John L. Watson, Edgewood, Wash. (US); Robert Plunkett, Sunnyvale, Calif. (US); Stephen L. Wasson, Marina, Calif. (US); Brian A. Box, Seabrook, N.H. (US); Enno Wein, San Jose, Calif. (US); and Charles A. Furciniti, Bedford, N.H. (US)
Assigned to Element CXI, LLC, Milpitas, Calif. (US)
Filed on Jun. 21, 2007, as Appl. No. 11/766,297.
Application 11/766297 is a continuation in part of application No. 11/471875, filed on Jun. 21, 2006, granted, now 7,429,870, filed on Sep. 30, 2008.
Application 11/471875 is a continuation in part of application No. 11/471832, filed on Jun. 21, 2006, granted, now 7,427,871, filed on Sep. 23, 2008.
Prior Publication US 2008/0036489 A1, Feb. 14, 2008
This patent is subject to a terminal disclaimer.
Int. Cl. H03K 19/003 (2006.01)
U.S. Cl. 326—9  [326/10; 326/14; 326/41] 78 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a communication element; and
a plurality of composite circuit elements coupled to the communication element, each composite circuit element comprising an element interface and a circuit element of a plurality of circuit element types, a first composite circuit element of the plurality of composite circuit elements to perform a first function, a second composite circuit element of the plurality of composite circuit elements to perform a second function, a third composite circuit element of the plurality of composite circuit elements to perform the second function, the first composite circuit element having an assigned first data link to the second composite circuit element for performance of a first data operation or an assigned second data link to the third composite circuit element for performance of the first data operation.