| US 7,616,018 B2 | ||
| Integrated circuit probing apparatus having a temperature-adjusting mechanism | ||
| Choon Leong Lou, Hsinchu County (Taiwan); and Li Min Wang, Hsinchu County (Taiwan) | ||
| Assigned to Star Technologies Inc., Hsinchu County (Taiwan) | ||
| Filed on Mar. 12, 2008, as Appl. No. 12/46,818. | ||
| Application 12/046818 is a division of application No. 11/609558, filed on Dec. 12, 2006, granted, now 7,576,553. | ||
| Prior Publication US 2008/0150567 A1, Jun. 26, 2008 | ||
| Int. Cl. G01R 31/02 (2006.01) | ||
| U.S. Cl. 324—760 | 4 Claims |
| 1. An integrated circuit probing apparatus, comprising:
a circuit board having a plurality of laminates;
at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit
device facing a first surface of the circuit board;
a holder configured to support the circuit board; and
a temperature-adjusting mechanism positioned in one of the laminates,
wherein the temperature-adjusting mechanism is disposed inside the circuit board,
wherein the temperature-adjusting mechanism includes at least one flow line having at least one fluid inlet and a plurality
of fluid outlets.
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