US 7,616,016 B2
Probe card assembly and kit
Benjamin N. Eldridge, Danville, Calif. (US); Igor Y. Khandros, Orinda, Calif. (US); and A. Nicholas Sporck, Saratoga, Calif. (US)
Assigned to FormFactor, Inc., Livermore, Calif. (US)
Filed on Apr. 01, 2008, as Appl. No. 12/60,753.
Application 12/060753 is a continuation of application No. 11/423808, filed on Jun. 13, 2006, granted, now 7,352,196.
Application 11/423808 is a continuation of application No. 10/889334, filed on Jul. 12, 2004, granted, now 7,061,257.
Application 10/889334 is a continuation of application No. 10/458875, filed on Jun. 10, 2003, granted, now 6,838,893.
Application 10/458875 is a continuation of application No. 09/042606, filed on Mar. 16, 1998, granted, now 7,064,566.
Application 09/042606 is a continuation in part of application No. 08/554902, filed on Nov. 09, 1995, granted, now 5,974,662.
Application 08/554902 is a continuation in part of application No. 08/452255, filed on May 26, 1995, granted, now 6,336,269.
Application 08/452255 is a continuation in part of application No. 08/340144, filed on Nov. 15, 1994, granted, now 5,917,707.
Application 08/340144 is a continuation in part of application No. 08/152812, filed on Nov. 16, 1993, granted, now 5,476,211.
Claims priority of provisional application 60/040983, filed on Mar. 17, 1997.
Prior Publication US 2008/0180121 A1, Jul. 31, 2008
Int. Cl. G01R 31/02 (2006.01)
U.S. Cl. 324—754  [324/761; 324/762] 15 Claims
OG exemplary drawing
 
1. A probe card assembly comprising:
a probe substrate comprising traces;
an interconnection substrate coupled to the probe substrate;
a plurality of probes disposed on and extending from a first face of the interconnection substrate; and
a flexible cable comprising a first end connected to the first face of the interconnection substrate and a second end connected to the probe substrate to provide electrical connections between the interconnection substrate and the probe substrate.