| US 7,615,856 B2 | ||
| Integrated antenna type circuit apparatus | ||
| Atsushi Sakai, Gifu (Japan); Ryosuke Usui, Ichinomiya (Japan); and Yasunori Inoue, Ogaki (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Aug. 31, 2005, as Appl. No. 11/215,131. | ||
| Claims priority of application No. 2004-254066 (JP), filed on Sep. 01, 2004; application No. 2004-279398 (JP), filed on Sep. 27, 2004; and application No. 2005-243651 (JP), filed on Aug. 25, 2005. | ||
| Prior Publication US 2006/0049995 A1, Mar. 09, 2006 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—686 [257/E21.614; 257/685; 257/723; 257/777; 438/108; 438/109; 361/760] | 6 Claims |
| 1. A semiconductor integrated circuit apparatus comprising:
an insulating resin film;
a first circuit device embedded in the insulating resin film;
a flat-shaped wiring layer of fixed potential, being formed on the insulating resin film above the first circuit device; and
a second circuit device formed on the wiring layer, wherein
the first circuit device or the second circuit device is a capacitive chip including a plurality of capacitive device units,
at least one of the capacitive device units has a low-capacity capacitor and a high-capacity capacitor, and
the low-capacity capacitor and the high-capacity capacitor are connected in parallel.
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