| US 7,615,848 B2 | ||
| Semiconductor device and a method of manufacturing the same | ||
| Ken Uchikoshi, Hitachinaka (Japan); Naokatsu Suwanai, Hitachinaka (Japan); Atsushi Tachigami, Mito (Japan); Katsuhiko Hotta, Hachioji (Japan); Masashi Sahara, Hitachinaka (Japan); and Kazuhiko Sato, Sagamihara (Japan) | ||
| Assigned to Renesas Technology Corp., Tokyo (Japan); and Hitachi ULSI Systems Co., Ltd., Tokyo (Japan) | ||
| Filed on Jun. 12, 2008, as Appl. No. 12/137,904. | ||
| Application 11/806444 is a division of application No. 11/602196, filed on Nov. 21, 2006, granted, now 7,303,986. | ||
| Application 12/137904 is a continuation of application No. 11/806444, filed on May 31, 2007, granted, now 7,400,046. | ||
| Application 11/602196 is a continuation of application No. 10/732518, filed on Dec. 11, 2003, granted, now 7,189,637. | ||
| Claims priority of application No. 2002-362420 (JP), filed on Dec. 13, 2002. | ||
| Prior Publication US 2008/0277794 A1, Nov. 13, 2008 | ||
| Int. Cl. H01L 23/544 (2006.01) | ||
| U.S. Cl. 257—620 [257/758] | 17 Claims |
| 1. A semiconductor integrated circuit device comprising:
a semiconductor substrate having a main surface such that a peripheral region of the main surface surrounds a circuit region
of the main surface;
a first insulating film formed over the main surface;
external terminals formed over the first insulating film and arranged over the peripheral region;
a first guard ring formed over the first insulating film and arranged as a frame in a plane along an outer periphery of the
semiconductor substrate,
the frame of the first guard ring being nearer the outer periphery of the semiconductor substrate than are the external terminals
and being comprised of a same metal wiring layer as that of the external terminals;
a second insulating film formed over the first insulating film and over the first guard ring and having openings exposing
the external terminals,
the second insulating film having a first portion formed over the circuit region and a second portion formed over the peripheral
region such that the first portion and the second portion are formed separately and isolated from each other, and
the second portion extending over the first guard ring; and
bonding wires or bumps being in contact with the external terminals through the openings.
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