US 7,615,414 B2
	Dental intraoral radiological image sensor with a fiber-optic plate
Lionel Fritsch, St Etienne de Crossey (France); and Pierre Cambou, Grenoble (France)
Assigned to E2V Semiconductors, (France)
Appl. No. 11/994,402 PCT Filed Jun. 29, 2006, PCT No. PCT/EP2006/063675 § 371(c)(1), (2), (4) Date Dec. 31, 2007, PCT Pub. No. WO2007/003571, PCT Pub. Date Jan. 11, 2007.
Claims priority of application No. 05 07034 (FR), filed on Jul. 01, 2005.
Prior Publication US 2009/0224161 A1, Sep. 10, 2009
Int. Cl. H01L 21/00 (2006.01); G01J 5/02 (2006.01); H01L 27/15 (2006.01); H01L 29/26 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2006.01)

U.S. Cl. 438—113  [438/59; 438/106; 250/339.02; 257/80; 257/E21.502]

19 Claims

1. A method of fabricating a dental intraoral radiological image sensor, comprising the following steps: combining a semiconductor wafer for the collective production of a structure; bearing a matrix of photosensitive detectors integrated into the wafer, and a fiber-optic plate fixed by wafer bonding, thinning the semiconductor wafer in a step subsequent to the formation of the image detection circuits on the wafer, and producing external access contact pads on that face of the wafer which is not fixed to the fiber plate, said contact pads being for controlling the circuits and for receiving image signals coming from the sensor, the fiber-optic plate having a thickness such that the fiber-optic plate provides most of the mechanical integrity of the structure once the wafer has been thinned, and does so right to the end of the collective fabrication, the assembled structure including the wafer and the plate being subsequently diced into individual chips.