US 7,615,330 B2
Positive resist composition and pattern formation method using the same
Sou Kamimura, Shizouka (Japan); Tomoya Sasaki, Shizuoka (Japan); Yasutomo Kawanishi, Shizuoka (Japan); and Kenji Wada, Shizuoka (Japan)
Assigned to FUJIFILM Corporation, Tokyo (Japan)
Filed on Mar. 26, 2007, as Appl. No. 11/727,267.
Claims priority of application No. 2006-086217 (JP), filed on Mar. 27, 2006; and application No. 2006-257965 (JP), filed on Sep. 22, 2006.
Prior Publication US 2007/0224540 A1, Sep. 27, 2007
Int. Cl. G03F 7/004 (2006.01); G03F 7/30 (2006.01)
U.S. Cl. 430—270.1  [430/326; 430/921; 430/922] 11 Claims
 
1. A positive resist composition comprising:
a compound including a sulfonium cation having a structure represented by the following formula (Z-I);
a low molecular weight compound which increases solubility in an alkali developing solution by an action of an acid; and
a compound which generates a compound having a structure represented by the following formula (A-I) upon irradiation of an actinic ray or a radiation:

OG Complex Work Unit Drawing
wherein Y1 to Y13 each independently represents a hydrogen atom or a substituent, or adjacent members of Y1 to Y13 may be combined with each other to form a ring, and Z represents a single bond or a divalent connecting group;
Q-A−(X)n—B—R  (A-I)
wherein Q represents a sulfo group or a carboxyl group, A represents a divalent connecting group, X represents —SO2— or —CO—, n represents 0 or 1, B represents a single bond, an oxygen atom or —N(Rx)— in which Rx represents a hydrogen atom or a monovalent organic group, R represents a monovalent organic group including a proton acceptor functional group or a monovalent organic group including an ammonium group, and when B represents —N(Rx)—, R and Rx may be combined with each other to form a ring.