| US 7,615,133 B2 | ||
| Electrostatic chuck module and cooling system | ||
| Noriaki Tateno, Fukuoka (Japan); Jun Miyaji, Fukuoka (Japan); Yasumi Sago, Tokyo (Japan); Masayoshi Ikeda, Tokyo (Japan); Kazuaki Kaneko, Tokyo (Japan); Tomio Takamura, Yamaguchi (Japan); Tadashi Hirayama, Yamaguchi (Japan); Yoshiyuki Ikemura, Yamaguchi (Japan); and Masahiko Tamaru, Yamaguchi (Japan) | ||
| Assigned to Toto Ltd., Tokyo (Japan); and Canon Anelva Corporation, Tokyo (Japan) | ||
| Appl. No. 10/497,720 PCT Filed Dec. 03, 2002, PCT No. PCT/JP02/12658 § 371(c)(1), (2), (4) Date Jan. 31, 2005, PCT Pub. No. WO03/049180, PCT Pub. Date Jun. 12, 2003. |
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| Claims priority of application No. 2001-369957 (JP), filed on Dec. 04, 2001. | ||
| Prior Publication US 2005/0127619 A1, Jun. 16, 2005 | ||
| Int. Cl. C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01) | ||
| U.S. Cl. 156—345.53 [156/345.51; 156/345.52; 118/728; 361/234] | 8 Claims |
| 1. An electrostatic chuck module comprising:
an electrostatic chuck plate;
a cooling plate bonded to the electrostatic chuck plate comprising a body formed by bonding an upper portion to a lower portion,
wherein each of said upper and lower portions is made by forging a 100% metal composite comprising at least one metal material
selected from a group consisting of Cu—W, Cu—W—Ni, Cu—Mo, and Cu—Mo—Ni;
a plurality of projections in a space between the upper portion and the lower portion; and
a coolant filling in the space;
wherein the forging of each of the upper and lower portions is conducted such that a theoretical density ratio is 97% or more
and a forging ratio is 5% or more; and
wherein said electrostatic chuck module has a leakage amount of ≤7.5×10−9 (Pa·m3/sec) as determined by HOOD TEST.
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