| US 7,614,301 B2 | ||
| Acceleration sensor chip package and method of producing the same | ||
| Yoshihiro Saeki, Tokyo (Japan) | ||
| Assigned to Oki Semiconductor Co., Ltd., Tokyo (Japan) | ||
| Filed on Oct. 18, 2007, as Appl. No. 11/907,877. | ||
| Application 11/907877 is a continuation of application No. 11/238014, filed on Sep. 29, 2005, granted, now 7,299,696. | ||
| Claims priority of application No. 2004-299568 (JP), filed on Oct. 14, 2004. | ||
| Prior Publication US 2008/0047345 A1, Feb. 28, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G01P 15/08 (2006.01) | ||
| U.S. Cl. 73—514.33 [73/514.01; 73/514.38] | 19 Claims |
| 1. An acceleration sensor chip package, comprising:
an acceleration sensor chip including a frame portion having an upper surface and a lower surface opposite to the upper surface,
an opening portion formed in the frame portion and extending from the upper surface to the lower surface, a movable structure
having a beam portion extending from the frame portion toward inside the opening portion and a movable portion disposed in
the opening portion and supported on the beam portion to be movable, a detection element for detecting a movement of the movable
structure, and an electrode pad electrically connected to the detection element and exposed from the upper surface;
an outer terminal disposed on the upper surface and electrically connected to the electrode pad;
a substrate attached to the lower surface for sealing the opening portion from a side of the lower surface; and
a first sealing portion disposed on the upper surface for sealing the electrode pad and the outer terminal such that a part
of the outer terminal and an entire portion of the movable portion are exposed.
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