| US 7,614,142 B2 | ||
| Method for fabricating an interposer | ||
| Takeshi Shioga, Kawasaki (Japan); Yoshikatsu Ishizuki, Kawasaki (Japan); Kanae Nakagawa, Kawasaki (Japan); Taiji Sakai, Kawasaki (Japan); Masataka Mizukoshi, Kawasaki (Japan); John David Baniecki, Kawasaki (Japan); and Kazuaki Kurihara, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Feb. 05, 2008, as Appl. No. 12/68,272. | ||
| Application 12/068272 is a division of application No. 11/338857, filed on Jan. 25, 2006, granted, now 7,355,290. | ||
| Claims priority of application No. 2005-286978 (JP), filed on Sep. 30, 2005. | ||
| Prior Publication US 2008/0134499 A1, Jun. 12, 2008 | ||
| Int. Cl. H05K 3/36 (2006.01); H01L 23/29 (2006.01) | ||
| U.S. Cl. 29—830 [29/25.35; 29/25.42; 29/592.1; 29/832; 361/306.2; 257/790; 174/262] | 12 Claims |
| 1. A method for fabricating an interposer comprising the steps of:
forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline
capacitor dielectric film formed on the first capacitor electrode and a second capacitor electrode formed on the capacitor
dielectric film;
forming on said one primary surface of the first substrate and the thin film capacitor a first resin layer as semi-cured,
and a first partial electrode to be a part of a through-electrode, buried in the first resin layer and electrically connected
to the first capacitor electrode or the second capacitor electrode;
cutting an upper part of the first partial electrode and an upper part of the first resin layer with a cutting tool;
forming on one primary surface of a second substrate a second resin layer as semi-cured, and a second partial electrode to
be a part of said through-electrode, buried in the second resin layer and disposed in alignment with the first partial electrode;
cutting an upper part of the second partial electrode and an upper part of the second resin layer with a cutting tool;
making thermal processing with the first resin layer and the second resin layer in close contact with each other to adhere
the first resin and the second resin layer to each other while joining the first second partial electrode and the second partial
electrode to each other;
removing the first substrate;
forming on said one primary surface of the second substrate a third resin layer, covering the thin-film capacitor;
burying a third partial electrode to be a part of the through-electrode in the third resin layer;
supporting the third resin layer by a supporting substrate; and
removing the second substrate.
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