| US 7,446,265 B2 | ||
| Board level shielding module | ||
| Eric G. Krohto, Merrimac, Mass. (US); Lawrence J. Denefrio, Windham, N.H. (US); Peter Jones, Lutz, Fla. (US); John C. Ariel, Nashua, N.H. (US); Matthew T. Gagnon, Topsfield, Mass. (US); Douglas Nobbs, Dover, N.H. (US); George R. Watchko, Stoneham, Mass. (US); and Marc E. LaRosse, Winthrop, Mass. (US) | ||
| Assigned to Parker Hannifin Corporation, Cleveland, Ohio (US) | ||
| Filed on Apr. 14, 2006, as Appl. No. 11/404,704. | ||
| Claims priority of provisional application 60/671802, filed on Apr. 15, 2005. | ||
| Prior Publication US 2006/0260839 A1, Nov. 23, 2006 | ||
| Int. Cl. H05K 9/00 (2006.01); H02B 1/015 (2006.01); H01T 13/08 (2006.01) | ||
| U.S. Cl. 174—377 [174/369; 174/370; 361/816] | 31 Claims |
| 1. An apparatus for shielding electromagnetic interference in a printed circuit board, said apparatus comprising:
a plastic part having one or more compartments providing an enclosure, said plastic part having at least first and second
opposed surfaces, the first surface being attached to the printed circuit board;
a continuous metal conformal coating applied onto at least the second surface of said plastic part, said metal conformal coating
having a thickness of from about 0.0001 inches to about 0.005 inches; and
a form-in-place electromagnetic interference gasket applied to the top surface of said metal conformal coating covering the
plastic part in an area of a part flange.
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