| US 7,445,967 B2 | ||
| Method of packaging a semiconductor die and package thereof | ||
| David F. Abdo, Scottsdale, Ariz. (US); Alexander J. Elliott, Tempe, Ariz. (US); and Lakshminarayan Viswanathan, Phoenix, Ariz. (US) | ||
| Assigned to Freescale Semiconductor, Inc., Austin, Tex. (US) | ||
| Filed on Jan. 20, 2006, as Appl. No. 11/336,368. | ||
| Prior Publication US 2007/0172990 A1, Jul. 26, 2007 | ||
| Int. Cl. H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—123 | 20 Claims |
| 1. A method of packaging a semiconductor die comprising:
providing a flange;
coupling one or more active die to the flange with a metallurgical material;
after coupling the one or more active die to the flange, mechanically staking a leadframe to the flange;
using wire bonds to electrically interconnect the one or more active die and the leadframe; and
overmolding a plastic material over at least a portion of the flange, the one or more active die, a portion of the leadframe,
and the wire bonds,
wherein:
providing the flange further comprises:
providing the flange comprised of a first material and a second material;
the first material is more ductile and thermally conductive than the second material;
the second material is more rigid than the first material; and
the first material is closer to the one or more active die than the second material.
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