| US 7,445,457 B1 | ||
| Techniques for connecting midplane connectors through a midplane | ||
| Ralph C. Frangioso, Jr., Franklin, Mass. (US); Robert Wierzbicki, Worcester, Mass. (US); and Michael L. Schillinger, Auburn, Mass. (US) | ||
| Assigned to EMC Corporation, Hopkinton, Mass. (US) | ||
| Filed on Sep. 27, 2007, as Appl. No. 11/862,761. | ||
| Int. Cl. H01R 12/00 (2006.01) | ||
| U.S. Cl. 439—61 [361/805; 439/65] | 25 Claims |
| 1. A midplane assembly, comprising:
a midplane having dielectric material and a set of plated through holes supported by the dielectric material, the dielectric
material substantially defining a first side and a second side of the midplane, the set of plated through holes being arranged
within the dielectric to form a first profile of plated through holes and a second profile of plated through holes, the first
profile of plated through holes having (i) an overlapping portion which overlaps at least part of the second profile of plated
through holes and (ii) a non-overlapping portion which does not overlap any part of the second profile of plated through holes;
a first connector arranged to mount to the first side of the midplane over the first profile of plated through holes; and
a second connector arranged to mount to the second side of the midplane over the second profile formed by the set of plated
through holes;
at least one plated through hole of the set of plated through holes being a shared plated through hole which resides in both
the first and second profiles and which engages a pin of the first connector and a pin of the second connector; and
at least one plated through hole of the set of plated through holes being a non-shared plated through hole which resides in
the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins
of the second connector.
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