US 7,612,873 B2
Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method
Kumiko Akashika, Kyoto (Japan); and Masahiro Horie, Kyoto (Japan)
Assigned to Dainippon Screen Mfg. Co., Ltd., Kyoto (Japan)
Filed on Oct. 31, 2007, as Appl. No. 11/979,116.
Claims priority of application No. P2006-306471 (JP), filed on Nov. 13, 2006; and application No. P2007-237381 (JP), filed on Sep. 13, 2007.
Prior Publication US 2008/0111987 A1, May 15, 2008
Int. Cl. G01B 11/16 (2006.01)
U.S. Cl. 356—32 20 Claims
OG exemplary drawing
 
1. A surface form measuring apparatus for measuring surface form of an object, comprising:
a light source for emitting a light;
an optical system for directing said light emitted from said light source to an irradiation region on an object through an objective lens and directing a reflected light reflected on said irradiation region to a predetermined position through said objective lens;
a light shielding pattern positioned at a position almost optically conjugate to an aperture stop position on an optical path from said light source to said irradiation region;
an imaging part for acquiring an image of said light shielding pattern formed on said predetermined position;
a gradient vector calculation part for obtaining a gradient vector indicating a normal direction of said irradiation region on the basis of an output of said imaging part;
a moving mechanism for moving said irradiation region relatively to said object; and
a surface form calculation part for obtaining surface form of said object on the basis of gradient vectors in a plurality of areas on said object, said gradient vectors being obtained by said gradient vector calculation part.