US 7,612,825 B2
Cylindrical camera module with pivot assembly
Kia Silverbrook, Balmain (Australia); Simon Robert Walmsley, Balmain (Australia); and Paul Lapstun, Balmain (Australia)
Assigned to Silverbrook Research Pty Ltd, Balmain, New South Wales (Australia)
Filed on Nov. 22, 2004, as Appl. No. 10/992,748.
Application 10/992748 is a continuation of application No. 10/636234, filed on Aug. 08, 2003.
Application 10/636234 is a continuation of application No. 09/575135, filed on May 23, 2000, granted, now 6,812,972.
Claims priority of application No. PQ0560 (AU), filed on May 25, 1999.
Prior Publication US 2005/0073587 A1, Apr. 07, 2005
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 5/225 (2006.01)
U.S. Cl. 348—373  [348/207.2] 3 Claims
OG exemplary drawing
 
1. A camera module including:
an image capture portion having a lens system, an imaging sensor and an image processor formed inside a cylindrical body, an imaging direction of said lens system being in the direction of the principle axis of the cylindrical body, the image sensor capturing an image in a first color space, and the image processor receiving the image in the first color space and converting the image to a second color space, the second color space being a device independent color space;
a cylindrical base portion having electrical contacts for connecting to a peripheral device in order to transfer the image in the second color space to the peripheral device; and
a pivot assembly for connecting said image capture portion to said cylindrical base portion and allowing said image capture portion to be movable about said pivot assembly between an inoperative position where said image capture portion and said cylindrical base portion are co-axial, and an operative position where the axis of said cylindrical body of said image capture portion is substantially perpendicular to the axis of said cylindrical base portion, said pivot assembly including a flexible printed circuit board traversing the pivot assembly and providing interconnection between said imaging sensor and said electrical contacts.