| US 7,612,448 B2 | ||
| Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner | ||
| Junichi Teraki, Kusatsu (Japan); and Mitsuhiro Tanaka, Kusatsu (Japan) | ||
| Assigned to Daikin Industries, Ltd., Osaka (Japan) | ||
| Appl. No. 11/791,844 PCT Filed Dec. 01, 2005, PCT No. PCT/JP2005/022061 § 371(c)(1), (2), (4) Date May 30, 2007, PCT Pub. No. WO2006/064666, PCT Pub. Date Jun. 22, 2006. |
||
| Claims priority of application No. 2004-359665 (JP), filed on Dec. 13, 2004; and application No. 2005-109720 (JP), filed on Apr. 06, 2005. | ||
| Prior Publication US 2008/0111151 A1, May 15, 2008 | ||
| Int. Cl. H01L 31/111 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01) | ||
| U.S. Cl. 257—713 [257/E23.051; 257/E23.098; 257/E23.105; 257/E23.016; 257/E25.03; 257/675; 257/177; 257/714; 257/712; 257/717; 257/720; 257/668; 257/685; 257/529; 257/532; 438/122] | 20 Claims |
| 1. A power module comprising:
a power semiconductor device and a non-power semiconductor device configuring a power supply circuit to perform power conversion;
a resin substrate, both the power semiconductor device and the non-power semiconductor device being mounted on the resin substrate;
and
a cooling device being configured to cool the power semiconductor device, the cooling device including a cooling fluid passage
disposed on a side opposite a mounting surface of the resin substrate, the power semiconductor device and the non-power semiconductor
device being mounted on the mounting surface of the resin substrate, the cooling fluid passage allowing a cooling fluid to
cool the power semiconductor device to pass therethrough,
a shortest distance between the power semiconductor device and the cooling fluid passage being shorter than a shortest distance
between the non-power semiconductor device and the cooling fluid passage.
|