a thermal conductive path comprising a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module;

airflow paths between the structure and the in-line chip module formed when the structure is affixed to the in-line chip module;

openings at a left-side of the structure, a right-side of the structure, and a bottom of the structure for easily affixing and removing the structure from the in-line chip module;

the structure further comprising:

a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and further comprising an angled surface extending from the top surface, the angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface;

a center horizontal part, the center horizontal part angled inward from the top part such that the center horizontal part is in good thermal contact with a plurality of chips affixed to a printed circuit board of the in-line chip module, the center horizontal part having the length of the in-line chip module and a width of the plurality of chips wherein the center horizontal part has horizontal fins that are formed adjacent to compliant slots in the front and back surfaces;

a gap between the center horizontal part and the plurality of chips, the gap for placement of a thermal interface material; and

a flared bottom area of the structure, extending outward from the in-line chip module and ending in a vertical lip, the bottom area of the structure having no contact with the in-line chip module when affixed to the in-line chip module.