| US 7,612,438 B2 | ||
| Active matrix substrate with height control member | ||
| Masahiko Akiyama, Tokyo (Japan); Yujiro Hara, Yokohama (Japan); Yutaka Onozuka, Yokohama (Japan); Tsuyoshi Hioki, Yokohama (Japan); and Mitsuo Nakajima, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jul. 13, 2005, as Appl. No. 11/179,565. | ||
| Application 11/179565 is a continuation of application No. 10/187015, filed on Jul. 02, 2002, granted, now 6,936,912. | ||
| Claims priority of application No. 2001-208723 (JP), filed on Jul. 10, 2001. | ||
| Prior Publication US 2005/0243229 A1, Nov. 03, 2005 | ||
| Int. Cl. H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—676 [257/88; 257/390; 257/443; 257/746; 257/E23.031] | 7 Claims |
| 1. An active matrix substrate comprising:
a substrate;
a plurality of adhesion parts provided on said substrate having substantially the same height, each of said plurality of adhesion
parts including an insulative height control member and an adhesive; and
a plurality of active elements each having at least one contact section on an upper surface thereof, each having a bottom
surface smaller in area than an upper surface of said respective one of said plurality of adhesion parts, and each being provided
on a respective one of said plurality of adhesion parts such that the bottom surface thereof is provided inside the insulative
height control member of said respective one of said plurality of adhesion parts.
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