| US 7,612,436 B1 | ||
| Packaged microelectronic devices with a lead frame | ||
| Teck Kheng Lee, Singapore (Singapore); Voon Siong Chin, Singapore (Singapore); and Ai-Chie Wang, Singapore (Singapore) | ||
| Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
| Filed on Jul. 31, 2008, as Appl. No. 12/183,981. | ||
| Int. Cl. H01L 23/495 (2006.01); H05K 5/02 (2006.01) | ||
| U.S. Cl. 257—672 [257/676; 257/690; 257/692; 257/784; 257/E23.043; 257/E23.052; 361/813] | 14 Claims |
| 1. A microelectronic device, comprising:
a leadframe disposed longitudinally between first and second ends and disposed latitudinally between first and second sides,
the leadframe including—
a first lead extending between the first end and the second end;
a second lead extending between the first end and the first side; and
a die paddle disposed longitudinally between the first and second ends and disposed latitudinally between the first and second
sides;
a first die mechanically coupled to the die paddle of the leadframe, the first die having a first edge proximate the first
end at the leadframe, a second edge spaced inwardly of the second end of the leadframe, integrated circuitry, and an external
terminal electrically connected to the integrated circuitry; and
a first wire bond electrically coupling one of the leads of the leadframe and the terminal of the first die.
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