| US 7,611,996 B2 | ||
| Multi-stage curing of low K nano-porous films | ||
| Francimar Schmitt, Santa Clara, Calif. (US); Yi Zheng, San Jose, Calif. (US); Kang Sub Yim, Santa Clara, Calif. (US); Sang H. Ahn, Foster City, Calif. (US); Lester A. D'Cruz, San Jose, Calif. (US); Dustin W. Ho, Fremont, Calif. (US); Alexandros T. Demos, Fremont, Calif. (US); Li-Qun Xia, Santa Clara, Calif. (US); Derek R. Witty, Fremont, Calif. (US); and Hichem M'Saad, Santa Clara, Calif. (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Mar. 21, 2005, as Appl. No. 11/85,416. | ||
| Claims priority of provisional application 60/558366, filed on Mar. 31, 2004. | ||
| Prior Publication US 2005/0230834 A1, Oct. 20, 2005 | ||
| Int. Cl. H01L 21/469 (2006.01); H01L 21/31 (2006.01) | ||
| U.S. Cl. 438—759 | 7 Claims |
| 1. A method of curing a chemical vapor deposited low K dielectric layer, the method comprising:
applying one of thermal energy and electron beam radiation to an as-deposited low K dielectric layer comprising labile carbon-containing
groups; and
applying the other of thermal energy and electron beam radiation to the as-deposited low K layer, displacing the labile carbon-containing
groups to form nanopores.
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