| US 7,611,967 B2 | ||
| Wafer sawing method | ||
| Sheng-Yang Peng, Kaohsiung (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
| Filed on Mar. 12, 2008, as Appl. No. 12/47,099. | ||
| Claims priority of application No. 96113436 A (TW), filed on Apr. 17, 2007. | ||
| Prior Publication US 2008/0261351 A1, Oct. 23, 2008 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—460 [438/110; 438/462] | 7 Claims |
| 1. A wafer sawing method for sawing a wafer by using a cutting tool, a surface of the wafer comprising a plurality of sawing
paths, the wafer sawing method comprising:
providing a carrier whose dimension is greater than a dimension of the wafer, having at least a fiducial mark being formed
on the carrier;
forming a plurality of strip-shaped adhesives on the carrier, corresponding to the plurlaity of sawing paths on the surface
of the wafer;
bonding the wafer to the carrier, wherein the surface of the wafer comrpising the plurlaity of sawing paths faces the carrier,
and the fiducial mark is disposed outside a bonding region between the wafer and the carrier, wherein the plurality of strip-shaped
adhesives within the bonding region is bonded to the plurlaity of sawing paths on the surface of the wafer;
positioning the cutting tool and the carrier according to the fiducial mark; and
sawing the wafer by using the cutting too.
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