| US 7,611,766 B2 | ||
| Wafer protective sheet | ||
| Masahiko Fuyumuro, Ashikaga (Japan); Yoshitaka Nakayama, Ashikaga (Japan); and Eiichi Kawashima, Ashikaga (Japan) | ||
| Assigned to Achilles Corporation, Tokyo (Japan) | ||
| Appl. No. 10/550,960 PCT Filed Apr. 08, 2004, PCT No. PCT/JP2004/005084 § 371(c)(1), (2), (4) Date Sep. 28, 2005, PCT Pub. No. WO2004/089784, PCT Pub. Date Oct. 21, 2004. |
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| Claims priority of application No. 2003-105958 (JP), filed on Apr. 10, 2003. | ||
| Prior Publication US 2006/0237343 A1, Oct. 26, 2006 | ||
| Int. Cl. B32B 1/00 (2006.01); B65D 85/00 (2006.01) | ||
| U.S. Cl. 428—174 [428/66.5; 428/179; 211/41.18; 206/710] | 7 Claims |
| 1. A wafer protective sheet comprising a synthetic resin sheet with a thickness of 80 to 130 μm having a large number of projected
parts and a large number of recessed parts on the respective front surface and rear surface thereof, wherein:
the large number of projected parts and the large number of recessed parts are respectively so disposed that each part is
positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each
other;
the sheet has such a wavy cross section that the recessed parts in the rear surface match the projected parts on the front
surface;
the sheet has flat parts oriented parallel to and between the projected parts and the recessed parts;
the projected parts on the rear surface match the recessed parts in the front surface; and
the wafer protective sheet has a bending resistance of 30 to 80 mm.
|