| US 7,611,589 B2 | ||
| Methods of spin-on wafer cleaning | ||
| Jun Wu, Gueishan Township, Taoyuan County (Taiwan); Dong-Xuan Lu, Miaoli Hsien (Taiwan); Shih-Chi Lin, Taipei (Taiwan); Wen-Long Lee, Taipei (Taiwan); Yi-An Jian, Banchiau (Taiwan); Guang-Cheng Wang, Taipei (Taiwan); Shiu-Ko JangJian, Fenshan (Taiwan); Chyi-Tsong Ni, Taipei (Taiwan); Szu-An Wu, Hsinchu (Taiwan); and Ying-Lang Wang, Longjing Township, Taichung County (Taiwan) | ||
| Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (Taiwan) | ||
| Filed on Mar. 04, 2005, as Appl. No. 11/72,114. | ||
| Prior Publication US 2006/0196526 A1, Sep. 07, 2006 | ||
| Int. Cl. B08B 3/02 (2006.01); B08B 1/04 (2006.01) | ||
| U.S. Cl. 134—33 [134/32; 134/34] | 14 Claims |
| 1. A spin clean method, comprising:
providing a pressurized cleaning liquid onto a wafer while spinning the wafer;
maintaining the product of the substantially vertical jet pressure on the wafer and wafer spin speed in a constant; and
changing substantially vertical jet pressure on the wafer and wafer spin speed in inverse proportion relationship.
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