| US 7,611,377 B2 | ||
| Interface apparatus for electronic device test apparatus | ||
| Shigeru Matsumura, Tokyo (Japan); Kazutaka Osawa, Tokyo (Japan); Hiroyuki Hama, Tokyo (Japan); and Yuichiro Izumi, Tokyo (Japan) | ||
| Assigned to Advantest Corporation, Tokyo (Japan) | ||
| Filed on Aug. 30, 2007, as Appl. No. 11/896,240. | ||
| Claims priority of application No. 2006-257922 (JP), filed on Sep. 22, 2006. | ||
| Prior Publication US 2008/0076297 A1, Mar. 27, 2008 | ||
| Int. Cl. H01R 13/00 (2006.01) | ||
| U.S. Cl. 439—482 | 6 Claims |
| 1. An interface apparatus mounted on a test head for testing a device under test and interconnecting an electrical connection
between the device under test and the test head, wherein
the interface apparatus comprises:
an electrical cable having one end electrically connected to a measurement board electrically contacting the device under
test;
a device side connector attached to the other end of the electrical cable; and
a plurality of intermediate connectors electrically connecting a test head side connector provided on the test head and the
device side connector; and
a frame-shaped frame holding a plurality of the intermediate connectors, and each of the intermediate connectors has:
a housing held at the both ends of the housing by the frame;
a plurality of first connection parts provided at the housing and to which the device side connector is detachably connected,
and
a plurality of second connection parts provided at the housing and to which the test head side connector is detachably connected
wherein a plurality of the intermediate connectors are collaterally arranged.
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