| US 7,610,670 B2 | ||
| Method for manufacturing a diaphragm assembly | ||
| Hiroshi Akino, Machida (Japan) | ||
| Assigned to Kabushiki Kaisha Audio-Technica, Machida-shi, Tokyo (Japan) | ||
| Filed on Jun. 30, 2006, as Appl. No. 11/477,925. | ||
| Prior Publication US 2006/0265861 A1, Nov. 30, 2006 | ||
| Int. Cl. H04R 31/00 (2006.01) | ||
| U.S. Cl. 29—594 [29/609.1; 29/876; 29/877; 29/886; 181/158; 216/62; 216/66; 216/67; 381/174; 381/191; 381/361; 438/3; 438/42; 438/57; 438/98] | 4 Claims |
| 1. A method for manufacturing a diaphragm assembly used for a condenser microphone and having a diaphragm made of a resin
film including a metallized film on one surface set up on a supporter ring, comprising:
a first step of bonding a ring jig of a larger diameter than the supporter ring to the resin film having the metallized film
composed of a ductile metallic material on one surface via an adhesive without exerting tension on the resin film;
a second step of heating and contracting the resin film bonded to the ring jig without applying the tension at a temperature
over a glass transition point of a film material; and
a third step of bonding the supporter ring to the resin film via an adhesive in a state of exerting predetermined tension
on the resin film and cutting the diaphragm assembly out of the resin film after waiting for hardening of the adhesive,
wherein the resin film is heated at a predetermined temperature after bonding the resin film to the supporter ring and before
cutting the resin film in the third step.
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