| US 7,609,581 B2 | ||
| Semiconductor memory device | ||
| Nobuaki Otsuka, Komae (Japan); and Osamu Hirabayashi, Tokyo (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jul. 02, 2007, as Appl. No. 11/772,587. | ||
| Application 11/772587 is a division of application No. 11/416122, filed on May 03, 2006, granted, now 7,362,646. | ||
| Claims priority of application No. 2006-067988 (JP), filed on Mar. 13, 2006. | ||
| Prior Publication US 2007/0280009 A1, Dec. 06, 2007 | ||
| Int. Cl. G11C 5/14 (2006.01) | ||
| U.S. Cl. 365—226 [365/229; 365/227; 365/189.09; 365/185.24] | 5 Claims |

| 1. A semiconductor memory device comprising:
a memory cell array provided in a cell array area and including a plurality of memory cells, each memory cell being of a static
type and formed of MIS transistors;
a source potential line which applies a source potential to the memory cells;
a switching element group including a plurality of switching elements and provided in the cell array area adjacent to the
memory cell array, the switching element group electrically connecting the source potential line to a power supply potential
line, when the memory cells are in an operation mode, and electrically disconnecting the source potential line from a ground
potential line, when the memory cells are in a sleep mode;
a first N-type MIS transistor connected between the source potential line and the power supply potential line, and fixing
the source potential when the memory cells are in the sleep mode; and
a bias generation circuit provided in a peripheral circuit area outside the cell array area, and supplying a first bias potential
to a gate terminal included in the first MIS transistor,
the first MIS transistor being provided in the peripheral circuit area.
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