US 7,609,558 B2
Non-volatile semiconductor memory device
Koji Hosono, Fujisawa (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on Sep. 08, 2006, as Appl. No. 11/530,347.
Claims priority of application No. 2005-263032 (JP), filed on Sep. 09, 2005.
Prior Publication US 2007/0058432 A1, Mar. 15, 2007
Int. Cl. G11C 11/34 (2006.01)
U.S. Cl. 365—185.23  [365/185.33; 365/185.17] 20 Claims
OG exemplary drawing
 
1. A non-volatile semiconductor memory device comprising:
a memory cell array having a plurality of electrically-programmable memory cells, said memory cells being multi-level cells, said memory cell array comprising,
a plurality of memory cell units, each memory cell unit including memory cells connected in series, each memory cell unit being connected to a source selection gate transistor at one end and to a drain selection gate transistor at the other end,
a plurality of word lines each connected to each of control gates of said memory cells, said plurality of word lines including a selected word line connected to a control gate of a selected memory cell to be programmed at a first time and then at a second time by applying to said selected word line a positive potential enough to turn on said selected memory cell before a next erasure operation, and a plurality of non-selected word lines except for said selected word line;
a plurality of bit lines each connected to said drain selection gate transistor of each of said plurality of said memory cell units; and
a source line commonly connected to the source side of said source selection gate transistor of each of said memory cell units,
wherein a potential applied to a non-selected word line adjacent to said selected word line at said second time of programming said selected memory cell is higher than a potential applied to said non-selected word line adjacent to said selected word line at said first time of programming said selected memory cell.