| US 7,608,911 B2 | ||
| Semiconductor device package having a semiconductor element with a roughened surface | ||
| Takashi Imoto, Yokohama (Japan); Chiaki Takubo, Tokyo (Japan); Ryuji Hosokawa, Ebina (Japan); Yoshihisa Imori, Yokohama (Japan); Takao Sato, Tokyo (Japan); Tetsuya Kurosawa, Yokohama (Japan); and Mika Kiritani, Kawasaki (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jun. 24, 2008, as Appl. No. 12/213,766. | ||
| Application 11/712373 is a division of application No. 11/088879, filed on Mar. 25, 2005, granted, now 7,202,563. | ||
| Application 12/213766 is a continuation of application No. 11/712373, filed on Mar. 01, 2007, granted, now 7,405,159. | ||
| Claims priority of application No. 2004-089476 (JP), filed on Mar. 25, 2004. | ||
| Prior Publication US 2008/0265443 A1, Oct. 30, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 29/06 (2006.01) | ||
| U.S. Cl. 257—622 [257/738; 257/787; 257/E23.127] | 13 Claims |
| 1. A semiconductor device comprising:
a ball grid array package having a first surface on which a plurality of metal balls are formed; and
a semiconductor element mounted in the package; a laminated film formed of a plurality of insulating films being formed on
an element formation surface of the semiconductor element, a peripheral portion of the laminated film being offset inwardly
from a peripheral portion of the semiconductor element, and electrode pads of the semiconductor element being formed on the
insulating films and connected to the semiconductor element through wirings formed between the insulating films, the electrode
pads of the semiconductor element being electrically connected to wirings of the package;
wherein a portion of the element formation surface of the semiconductor element which is between the peripheral portion of
the laminated film and the peripheral portion of the semiconductor element is removed to form an exposed portion, wherein
an insulating resin covers the exposed portion of the semiconductor element and the peripheral portion of the laminated film.
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