US 7,608,787 B2
Semiconductor memory device and USB memory device using the same
Yasuo Takemoto, Yokohama (Japan); Naohisa Okumura, Yokohama (Japan); Taku Nishiyama, Yokohama (Japan); and Takashi Okada, Yokohama (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on Sep. 13, 2006, as Appl. No. 11/531,589.
Claims priority of application No. 2005-270991 (JP), filed on Sep. 16, 2005; and application No. 2006-029220 (JP), filed on Feb. 07, 2006.
Prior Publication US 2007/0066102 A1, Mar. 22, 2007
Int. Cl. H05K 1/16 (2006.01)
U.S. Cl. 174—260  [361/737] 21 Claims
OG exemplary drawing
 
1. A USB memory device, comprising:
a semiconductor memory device, including:
a circuit board having a first principle surface and a second principle surface at an opposite side of the first principle surface;
a USB terminal formed on the first principle surface of the circuit board, and having a conductor layer to be an input/output terminal of a USB connector;
a memory element mounted on the second principle surface of the circuit board;
a sealing resin provided on the second principle surface of the circuit board so as to seal the memory element; and
an electronic component mounted on at least one of a region except a forming region of the USB terminal on the first principle surface of the circuit board and a region except a mounting region of the memory element on the second principle surface of the circuit board; and
a USB connector case to which at least a part of the semiconductor memory device is housed, having an upper wall facing with the first principle surface of the circuit board, a lower wall facing with the second principle surface of the circuit board, and side walls,
wherein the USB connector case has a projection projecting and folding a cut portion formed by cutting into a part of the upper wall toward the first principle surface of the circuit board, and being in contact with at least one of the first principle surface of the circuit board and the electronic component.