| US 7,608,487 B2 | ||
| B-stageable underfill encapsulant and method for its application | ||
| Allison Yue Xiao, Belle Mead, N.J. (US); Quinn K. Tong, Belle Mead, N.J. (US); Bodan Ma, Racine, Wis. (US); and Gyanendra Dutt, Piscataway, N.J. (US) | ||
| Assigned to Henkel AG & Co. KGaA, Düsseldorf (Germany) | ||
| Filed on Nov. 21, 2005, as Appl. No. 11/284,219. | ||
| Application 11/284219 is a continuation in part of application No. 10/084873, filed on Mar. 01, 2002, abandoned. | ||
| Prior Publication US 2006/0125119 A1, Jun. 15, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—127 [257/E21.502] | 6 Claims |
| 1. A method of preparing one or more silicon chips, comprising the steps of
a) applying to a semiconductor wafer an encapsulant comprising a thermally curable admixture of an epoxy resin having an epoxy
equivalent weight between 86 g/eg and 700 g/eg, a phenol-containing compound, an imidazole phosphate salt catalyst, and a
fluxing agent;
b) B-stage processing the encapsulant on the semiconductor wafer so that the encapsulant solidifies into a smooth, non-tacky
coating; and
c) dicing the semiconductor wafer into individual silicon chips.
|