| US 7,607,559 B2 | ||
| Conductive ball arraying apparatus | ||
| Yoshihisa Kajii, Ishikawa (Japan) | ||
| Assigned to Shibuya Kogyo Co., Ltd., Ishikawa-Ken (Japan) | ||
| Filed on Dec. 04, 2007, as Appl. No. 11/987,804. | ||
| Claims priority of application No. P2007-150250 (JP), filed on Jun. 06, 2007. | ||
| Prior Publication US 2008/0302856 A1, Dec. 11, 2008 | ||
| Int. Cl. B23K 3/06 (2006.01) | ||
| U.S. Cl. 228—41 [228/33; 228/245; 228/246] | 8 Claims |
| 1. A conductive ball arraying apparatus comprising:
an arraying jig including conductive ball insertion parts in a predetermined array pattern;
a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls
along with the arraying jig;
moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along
a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig;
floating means that floats the ball cup from the arraying jig; and
vibrating means that vibrates the ball cup,
wherein the moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup
from the arraying jig and vibrating the ball cup; and
the floating means ejects air to the top surface of the arraying jig from the bottom surface of the ball cup.
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