| US 7,602,613 B2 | ||
| Thin module system and method | ||
| Paul Goodwin, Austin, Tex. (US); James W. Cady, Austin, Tex. (US); and Douglas Wehrly, Austin, Tex. (US) | ||
| Assigned to Entorian Technologies, LP, Austin, Tex. (US) | ||
| Filed on Jan. 18, 2007, as Appl. No. 11/624,608. | ||
| Application 11/624608 is a division of application No. 10/934027, filed on Sep. 03, 2004. | ||
| Prior Publication US 2007/0115017 A1, May 24, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H05K 1/00 (2006.01) | ||
| U.S. Cl. 361—749 [361/803; 361/771; 361/720; 361/684; 361/719; 361/783; 361/767; 174/254] | 1 Claim |
| 1. A populated flexible circuit comprising:
a flexible circuit having a first major side and a second major side, the flexible circuit exhibiting along the first major
side, first-side first and second sets of contact site arrays between which is located a row of connector contacts, the second
major side of the flexible circuit exhibiting second-side first and second sets of contact site arrays which correspond to
the first-side first and second sets of contact site arrays, each of the first-side and second-side first and second sets
of contact site arrays comprising at least two surface mount arrays, the flexible circuit providing connections between the
at least two surface mount arrays of each of the first-side first and second sets of contact site arrays and the at least
two surface mount arrays of each of the second-side first and second sets of contact site arrays;
a plurality of CSPs that populate the at least two surface mount arrays of each of the first-side first and second sets of
contact site arrays and the at least two surface mount arrays of each of the second-side first and second sets of contact
site arrays; and
a support structure about which the flexible circuit transits through a bend such that the second-side first and second sets
of contact site arrays face the support structure.
|