| US 7,602,473 B2 | ||
| Exposure apparatus and device manufacturing method using the same | ||
| Akihiro Nakauchi, Utsunomiya (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Apr. 21, 2006, as Appl. No. 11/409,537. | ||
| Claims priority of application No. 2005-126391 (JP), filed on Apr. 25, 2005. | ||
| Prior Publication US 2006/0238737 A1, Oct. 26, 2006 | ||
| Int. Cl. G03B 27/42 (2006.01) | ||
| U.S. Cl. 355—67 [355/53; 362/268] | 12 Claims |
| 1. An exposure apparatus comprising:
an illumination optical system adapted to illuminate a reflection mask with light from an exposure light source; and
a projection optical system adapted to project a pattern image of the reflection mask disposed in an object plane onto a substrate
disposed in an image plane,
wherein the illumination optical system includes a reflection integrator adapted to form a plurality of secondary light sources
with the light from the exposure light source, a condenser unit adapted to superimpose beams of light from the plurality of
secondary light sources with one another on the reflection mask, and a mirror capable of being disposed in an optical path
instead of the reflection integrator,
wherein the reflection integrator and the condenser unit are arranged so that the object plane of the projection optical system
is subjected to Koehler illumination by the light from the exposure light source, and
wherein when the mirror is disposed in the optical path instead of the reflection integrator, an illuminated area formed in
the object plane of the projection optical system is reduced in comparison with an illuminated area formed when the reflection
integrator is disposed in the optical path.
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