| US 7,602,263 B2 | ||
| Branching filter package | ||
| Wataru Ohashi, Tokyo (Japan); Hajime Shimamura, Tokyo (Japan); Tomokazu Komazaki, Tokyo (Japan); and Yoshiaki Fujita, Tokyo (Japan) | ||
| Assigned to Oki Semiconductor Co., Ltd., Tokyo (Japan) | ||
| Filed on Oct. 30, 2007, as Appl. No. 11/978,671. | ||
| Application 11/978671 is a division of application No. 11/032145, filed on Jan. 11, 2005, granted, now 7,479,845. | ||
| Application 11/032145 is a division of application No. 10/114326, filed on Apr. 03, 2002, granted, now 6,937,113. | ||
| Application 09/785501 is a division of application No. 09/305304, filed on May 05, 1999, granted, now 6,222,426. | ||
| Application 10/114326 is a continuation in part of application No. 09/450997, filed on Nov. 29, 1999, abandoned. | ||
| Application 09/450997 is a continuation in part of application No. 09/305304, filed on May 05, 1999, granted, now 6,222,426. | ||
| Application 10/114326 is a continuation in part of application No. 09/785501, filed on Feb. 20, 2001, granted, now 6,870,440. | ||
| Claims priority of application No. 10-160088 (JP), filed on Jun. 09, 1998; and application No. 11-149959 (JP), filed on May 28, 1999. | ||
| Prior Publication US 2008/0136556 A1, Jun. 12, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H03H 9/72 (2006.01) | ||
| U.S. Cl. 333—133 [333/193] | 13 Claims |
| 1. A surface acoustic wave (SAW) duplexer comprising:
a transmitting SAW filter having a first input portion and a first output portion;
a receiving SAW filter having a second input portion and a second output portion;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed, wherein the single piezoelectric
substrate has first and second sides which face each other;
a package base board on which the single piezoelectric substrate is mounted;
an input terminal which is positioned on the package base board and outside the single piezoelectric substrate;
an output terminal which is positioned on the package base board and outside the single piezoelectric substrate;
a first interconnection line which is directly connected with the first output portion of the transmitting SAW filter and
which is electrically connected to the output terminal of the package base board; and
a second interconnection line which is directly connected with the second input portion of the receiving SAW filter and which
is electrically connected to the input terminal of the package base board,
wherein the first output portion of the transmitting SAW filter is positioned closer to the first side than the second side
of the single piezoelectric substrate, and the second input portion of the receiving SAW filter is positioned closer to the
second side than the first side of the single piezoelectric substrate,
wherein the first input portion of the transmitting SAW filter is positioned closer to the second side than the first side
of the single piezoelectric substrate, and the second output portion of the receiving SAW filter is positioned closer to the
first side than the second side of the single piezoelectric substrate,
wherein both of the input and output terminals are electrically connected to an antenna,
wherein the output portion of the transmitting SAW filter is positioned away from the input portion of the receiving SAW filter
on the single piezoelectric substrate, and
wherein the first and second interconnection lines extend each other in different directions.
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