| US 7,602,121 B2 | ||
| Glass package that is hermetically sealed with a frit and method of fabrication | ||
| Bruce G. Aitken, Corning, N.Y. (US); Joel P. Carberry, Horseheads, N.Y. (US); Steven E. DeMartino, West Elmira, N.Y. (US); Henry E. Hagy, Painted Post, N.Y. (US); Lisa A. Lamberson, Painted Post, N.Y. (US); Richard J. Miller, II, Bath, N.Y. (US); Robert Morena, Lindley, N.Y. (US); Joseph F. Schroeder, III, Lindley, N.Y. (US); Alexander Streltsov, Painted Post, N.Y. (US); and Sujanto Widjaja, Corning, N.Y. (US) | ||
| Assigned to Corning Incorporated, Corning, N.Y. (US) | ||
| Filed on Sep. 16, 2005, as Appl. No. 11/228,803. | ||
| Application 11/228803 is a division of application No. 10/414794, filed on Apr. 16, 2003, granted, now 6,998,776. | ||
| Prior Publication US 2006/0009109 A1, Jan. 12, 2006 | ||
| Int. Cl. H01J 1/62 (2006.01) | ||
| U.S. Cl. 313—512 | 25 Claims |
| 1. An organic light emitting diode device comprising:
a first glass substrate;
a second glass substrate;
an organic light emitting diode (OLED) positioned between the first and second glass substrates;
a frit positioned between the first and second glass substrates, the frit comprising a transition metal and a coefficient
of expansion (CTE) lowering filler, the filler being no more than about 30% by weight of the fit; and
wherein the OLED was hermetically sealed between the first and second glass substrates with a laser that heated and softened
the frit thereby forming a hermetic seal between the first and second substrates.
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